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FAQ

How do Cracking and Blistering form during Thermal Debinding? How can this be resolved?

(Background: The defects that arise after thermal debinding of green parts are not necessarily related to the thermal debinding process itself, but may originate from previous processes such as mixing and granulation, injection molding, or solvent debinding, and are amplified and made more visible during the thermal debinding process. During thermal debinding heating, the temperature should be controlled to ensure a slow tempe··· More

How do Warpage and Deformation occur during Solvent Debinding? How can this be resolved?

(Background: To remove as much binder as possible from the green body, degreasing requires an extremely slow heating rate and a long degreasing time, divided into 2 to 3 stages, with each stage removing a different component of the binder.)Mechanism:During solvent debinding, the solvent is typically heated to increase the reaction rate and improve debinding efficiency. However, heating can soften binders such as wax, and improper handli··· More

How is cracking formed during solvent debinding? How can this be resolved?

(Background: To remove as much binder as possible from the green body, degreasing requires an extremely slow heating rate and a long degreasing time, divided into 2 to 3 stages, with each stage removing a different component of the binder.)During solvent debinding, if the process is not operated properly, parts often develop cracks.Causes of cracking:  Binder expansion  Poor adhesion between binder and powder  Low binder strength &··· More

How do Weld Lines and Flow Marks occur? What are the solutions?

Primary Causes: Low feedstock temperatureLow mold temperatureLow barrel temperatureOther Causes: Improper mold design, such as long runners (resulting in lower feedstock temperature after traveling through a long runner), improper gate location (e.g., not allowing feedstock to flow from thicker wall sections to thinner wall sections), improper vent locations, etc.Mechanism:Flow marks: Occur when low-temperature injec··· More

What are the Solutions to address Sink Marks and Voids in MIM?

Formation MechanismsDuring MIM molding, precise control of temperature and pressure is critical. Low molding or hold pressure causes:Regions of low green densityIncomplete cavity fillingPoor vent design combined with long runners leads to:Premature gate solidificationInternal voids at thick sectionsThese low-density zones/voids form pits (sink marks) after sintering.Root Cause SummaryDefectPrimary CausesVoidsGas entrapment, moisture abs··· More

How Ejection Cracking are formed in the MIM Process? What are the solutions?

Possible CausesExcessive injection pressureCauses the green part to adhere too tightly to the mold cavity, leading to excessive force during ejection.Insufficient hold time & premature demoldingNon-uniform part density and inadequate structural strength to withstand ejection forces.Inadequate draft anglesHigh mold adhesion force generates shear stress during ejection.Poor ejector system designInsufficient or unevenly distributed ejector pins.··· More
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